W25X10A, W25X20A, W25X40A, W25X80A
12. PACKAGE SPECIFICATION
12.1 8-Pin SOIC 150-mil (Package Code SN)
8
? 1
5
4
E
H E
c
L
Y
D
A
0.25
O
SEATING PLANE
b
SYMBOL
e
A1
MILLIMETERS
Min Max
INCHES
Min Max
GAUGE PLANE
A
A1
b
1.35
0.10
0.33
1.75
0.25
0.51
0.053
0.004
0.013
0.069
0.010
0.020
c
E (3)
D (3)
e (2)
0.19
3.80
4.80
1.27 BSC
0.25
4.00
5.00
0.008 0.010
0.150 0.157
0.188 0.196
0.050 BSC
H E
Y (4)
L
?
5.80
-
0.40
6.20
0.10
1.27
10°
0.228
-
0.016
0.244
0.004
0.050
10°
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
- 38 -
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